Difference between revisions of "Balloons Gen 3 BMS"

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(Created page with "'''Cupcake''' is the 3rd iteration of the '''B'''attery '''M'''anagement '''S'''system for the HABEES Standard Avionics Platform. It addresses the complexity issue of the prev...")
 
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| header = Cupcake
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| img link = File:appleturnover.png
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| designer = Zachary Belateche
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| techline = Balloons Core Power
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| version = Generation III
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| name = Cupcake
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}}
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[[Category: High Altitude Balloons]][[Category: HABEES]]
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'''Cupcake''' is the 3rd iteration of the '''B'''attery '''M'''anagement '''S'''system for the HABEES Standard Avionics Platform. It addresses the complexity issue of the previous generation by removing the data collection circuitry/microcontroller, and adding a separate power path for expansion boards. It is compliant with the Gen 2 Architecture.<br/>
 
'''Cupcake''' is the 3rd iteration of the '''B'''attery '''M'''anagement '''S'''system for the HABEES Standard Avionics Platform. It addresses the complexity issue of the previous generation by removing the data collection circuitry/microcontroller, and adding a separate power path for expansion boards. It is compliant with the Gen 2 Architecture.<br/>
  

Revision as of 04:50, 15 July 2018

Cupcake
Part of the HABEES series
Appleturnover.png
Chief Designer Zachary Belateche
Technology Line Balloons Core Power
Version Generation III
Name Cupcake
General
HONEY Standards Venom Breakout Fang Breakout Board Naming
Core Architecture
Gen 1 Architecture HONEY
Core Avionics
Oscar Cookie Monster Elmo The Count
Core Power
Apple Turnover Biscuit
Core Peripherals
Medusa Cobra Viper QueenBee ProtoBee
Core Radio
Macaw
Test & Prototype
QueenBee
Guides
Making a HONEY Board Using STINGR Using QueenBee Making a Prototype
VE

Cupcake is the 3rd iteration of the Battery Management Ssystem for the HABEES Standard Avionics Platform. It addresses the complexity issue of the previous generation by removing the data collection circuitry/microcontroller, and adding a separate power path for expansion boards. It is compliant with the Gen 2 Architecture.

Outputs:

  • Main Avionics Power Path
    • 3.3V, 5V
  • Expansion Board Power Path
    • 1.8V, 3.3V, 5V
  • Shared raw cell voltage (VBAT)

Features of each power path:

  • Voltage and Current Protector (Undervoltage 3V, Overvoltage 5V, Overcurrent 5A)
  • Buckboost for 5V and LDO (low dropout regulator) for 3.3V

Additional features:

  • Temperature Monitor (Overtemp 50C, Heater activated at -10C)
  • inboard heater
  • Status LEDs for charging indicator and faults