Changes

* The data bus was split into two, and the number of pins broken out was reduced only to the number of GPIOs free after all avionics systems, simplifying routing and reducing the number of pins.

* The data bus was split into two, and the number of pins broken out was reduced only to the number of GPIOs free after all avionics systems, simplifying routing and reducing the number of pins.

**  

**  

* Abandoning an embedded RockBlock and its dedicated power circuitry, which required a large foot print and ultimately incredibly dense packing and clever routing to accommodate the rest of the system.

* Abandoning an embedded RockBlock and its dedicated power circuitry, which required a large footprint and ultimately incredibly dense packing and clever routing to accommodate the rest of the system.

* Removing auxiliary heater FETs

* Removing auxiliary heater FETs

* Removing some current sensors, because power consumption data for its own sake is not considered a priority for standard-profile launches

* Removing some current sensors, because power consumption data for its own sake is not considered a priority for standard-profile launches

== PCB Layout ==

== PCB Layout ==

Gen 5 Avionics remains a 4-layer board, compliant with Gen 2 Architecture. All signals were routed on the top and bottom layers, while only the heater trace went beyond those two layers. While it may be possible to route the heater trace on the top and bottom layer, it will be much more difficult, if impossible, to apply the traces directly to the components which require heat, such as the GPS and MCU.

Gen 5 Avionics remains a 4-layer board, compliant with Gen 2 Architecture. All signals were routed on the top and bottom layers, while only the heater trace went beyond those two layers. While it may be possible to route the heater trace on the top and bottom layer, it will be much more difficult, if impossible, to apply the traces directly to the components which require heat, such as the GPS and MCU.